Due to its good transparency, low fluorescence intensity, minimal expansion coefficient, strong resistance to thermal shock, positive chemical stability, scratch resistance, and low alkali content, glass wafers are widely used in high-tech products such as CMOS, CCD sensors, integrated circuits (ICs) or microelectromechanical system (MEMS) packaging, communication and data processing, optics, electronic products and scientific research.
Our company specializes in the long-term production of high-precision glass wafers with a thickness of ≥0.1mm and outer dimensions of ≥Φ2". In addition to the conventional Φ4-inch, Φ5-inch, Φ6-inch, Φ8-inch, and Φ12-inch sizes, we also offer customized services for other sizes. Glass wafers are typically made of materials such as Sodalime, Pyrex, Borofloat, Borosilicate (D263T), Corning E-XG, BK7, etc. For custom glass wafers made of other materials, please contact our sales.
In the electronics industry, glass wafers are used as substrates for manufacturing integrated circuits (ICs) microelectromechanical systems (MEMS), and other semiconductor devices. The glass provides a stable and inert surface for thin film deposition and circuit patterning. Additionally, glass wafers exhibit positive thermal performance, enabling efficient heat dissipation during device operation. As electronic device dimensions shrink and complexity increases, the demand for high-quality glass wafers with uniform thickness and low defect density becomes increasingly critical.
Optical applications also greatly benefit from glass wafers, particularly in the manufacturing of lenses, mirrors, and filters. The optical transparency and homogeneity of glass make it an ideal material for precision optical components used in cameras, telescopes, and laser systems. By carefully controlling the composition and thickness of glass wafers, manufacturers can customize their optical properties to meet specific requirements for light transmission, dispersion, and polarization.